Order #: 801683
ISBN #: 0791801683
Published: 2002
Product Type: Print-Book
No. of pages: 440
By Lian-Tuu Yeh and Richard C. Chu
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels.
This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies.
While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment.
The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume.
The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions.
They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.
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List of Figures. List of Tables. Nomenclature. Foreword. Preface.
Introduction. Conduction. Convection. Radiation. Pool Boiling. Flow Boiling. Condensation. Extended Surfaces. Thermal Interface Resistance. Components and Printed Circuit Boards. Direct Air Cooling and Fams. Natural and Mixed Convection. Heat Exchangers and Cold Plates. Advanced Cooling Technologies I: Single-Phase Liquid Cooling. Advanced Cooling Technologies II: Two-Phase Flow Cooling. Heat Pipes. Thermoelectric Coolers.
Appendices. Index. About the Authors.
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